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AssigneesHitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
InventorsYoshinori Miyaki, Hiromichi Suzuki, Kazunari Suzuki, Takafumi Nishita, Fujio Ito, Kunihiro Tsubosaki, Akihiko Kameoka, Kunihiko Nishi
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A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pad are sealed with a plastic mold. The semiconductor chip and the die pad are disposed within a cavity of a mold so that the clearance from the reverse surface of the die pad to the inside wall surface of the cavity opposite to the reverse surface of the die pad becomes narrower, by a length corresponding to the thickness of the die pad, than the clearance from the principal surface of the semiconductor chip to the inside wall surface of the cavity opposite to the principal surface of the semiconductor chip; and a resin is poured from a center gate into said cavity to form a plastic mold, which makes it possible to prevent said semiconductor chip from being lifted upwardly by the resin flowing in a filling region on the reverse surface side of the semiconductor chip. As a result, inconvenient shifting of the semiconductor chip, bonding wires and the like in the plastic mold can be prevented, leading to an increase in the yield of the plastic molded type semiconductor device.
A process for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip mounted on a principal surface of the die pad and said semiconductor chip and said die pad are sealed with a plastic mold, comprising:
A process of fabricating a plastic molded type semiconductor device, comprising the steps of:
A process of fabricating a plastic molded type semiconductor device, comprising the steps of:
Dependencies are inferred from the claim text.