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US 2026/0282945 A1Published application
Semiconductor device and manufacturing method therefor
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorHiroaki KISHI
Life of this patent
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Abstract
A semiconductor device includes: a die pad; an adhesive member provided on the die pad and having conductivity; a semiconductor chip provided on the adhesive member; and an encapsulation member provided on the adhesive member and the semiconductor chip. The adhesive member has a central portion in contact with the semiconductor chip and a peripheral portion around the central portion. An upper surface of the peripheral portion has unevenness.
Claims16
A semiconductor device comprising:
- a die pad;
- an adhesive member provided on the die pad and having conductivity;
- a semiconductor chip provided on the adhesive member;
- and
- an encapsulation member provided on the adhesive member and the semiconductor chip, wherein
- the adhesive member has a central portion in contact with the semiconductor chip and a peripheral portion around the central portion, and
- an upper surface of the peripheral portion has unevenness.
4 more elements
A method for manufacturing a semiconductor device, the method comprising:
- applying an adhesive member having conductivity on a die pad;
- molding the adhesive member by using a spanker, the spanker including a flat portion, a protrusion protruding downward from an outer peripheral portion of the flat portion, and a plurality of grooves provided in the protrusion;
- mounting a semiconductor chip on the adhesive member;
- and
- forming an encapsulation member on the semiconductor chip and the adhesive member to encapsulate the semiconductor chip with a resin.
2 more elements
Dependencies are inferred from the claim text.