Method and lead frame with die attach film
OwnerRongwei Zhang, Enis Tuncerinventors
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Abstract
A method includes forming a die attach film (DAF) on select portions of a metal substrate and forming lead frame features in the metal substrate while the DAF is present. A lead frame includes a metal substrate having opposite first and second sides that extend in respective first and second planes of a first direction and an orthogonal second direction, and openings extending between the first and second sides of the metal substrate in respective unit areas arranged in rows along the first direction and columns along the second direction, the respective unit areas including a prospective lead, and a DAF extending on select portions of the second side of the metal substrate.
Claims20
A method, comprising:
- forming a die attach film (DAF) on select portions of a metal substrate;
- and
- forming lead frame features in the metal substrate while the DAF is present.
A lead frame, comprising:
- a metal substrate having opposite first and second sides that extend in respective first and second planes of a first direction and an orthogonal second direction, and openings extending between the first and second sides of the metal substrate in respective unit areas arranged in rows along the first direction and columns along the second direction, the respective unit areas including a prospective lead;
- and
- a die attach film (DAF) extending on select portions of the second side of the metal substrate.
Dependencies are inferred from the claim text.