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US 12,708,031 B2Granted
Semiconductor package and manufacturing method therefor
AssigneeLG Innotek Co., Ltd.
InventorsTae Sup Choi, Woon Kang, Jin Ho Yoon
Life of this patent
Estimating the term…
Abstract
A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
Claims14
A semiconductor package comprising:
- a printed circuit board including a connection portion;
- an IC chip arranged on the printed circuit board;
- a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion;
- a bonding layer arranged between the solder portion and the connection portion;
- and
- an underfill arranged between the IC chip and the printed circuit board,
- wherein the bonding layer includes thermosetting resin,
- wherein the underfill includes thermoplastic resin,
- wherein the bonding layer comprises printing epoxy on the printed circuit board in a form of a gel-type resin,
- wherein the IC chip includes a first side, a second side opposing the first side, a third side connecting the first and second sides, and a fourth side opposing the third side,
- wherein the underfill includes a first underfill that overlaps, in a vertical direction, the first side and at least a portion of the third and fourth sides, and a second underfill that overlaps, in the vertical direction, the second side and at least another portion of the third and fourth sides, and
- wherein the first underfill and the second underfill are horizontally spaced apart from each other at the third side and the fourth side of the IC chip, respectively.
9 more elements
A manufacturing method of a semiconductor package comprising:
- (a) supplying a printed circuit board;
- (b) printing thermosetting resin on the printed circuit board;
- (c) applying a solder paste to the printed circuit board;
- (d) mounting an IC chip on the printed circuit board and applying thermoplastic resin around the IC chip;
- and
- (e) curing the thermosetting resin and the thermoplastic resin,
- wherein the thermoplastic resin comprises printing epoxy on the printed circuit board in a form of a gel-type resin,
- wherein the IC chip includes a first side, a second side opposing the first side, a third side connecting the first and second sides, and a fourth side opposing the third side,
- wherein the thermoplastic resin includes a first thermoplastic resin that overlaps, in a vertical direction, the first side and at least a portion of the third and fourth sides, and a second thermoplastic resin that overlaps, in the vertical direction, the second side and at least another portion of the third and fourth sides, and
- wherein the first thermoplastic resin and the second thermoplastic resin are horizontally spaced apart from each other at the third side and the fourth side of the IC chip, respectively.
7 more elements
Dependencies are inferred from the claim text.