Method of manufacturing semiconductor devices and corresponding semiconductor device

A method, comprising:

• arranging a semiconductor die on a surface of a layer of solder material provided at a die mounting region of a substrate, wherein a portion of the surface of the layer of solder material is left uncovered by the semiconductor die;
• removing portions of solder material from the layer of solder material to form a pattern of cavities extending into the surface of the layer of solder material at the portion left uncovered by the semiconductor die;
• and
• molding an electrically insulating encapsulation onto the semiconductor die arranged at the die mounting region of the substrate, wherein the electrically insulating encapsulation enters said cavities at the portion of the surface of the layer of solder material;
• wherein the pattern of cavities is configured to counter delamination of the electrically insulating encapsulation with respect to the solder material provided at the die mounting region of the substrate.