H10W 72/351
Materials of die-attach connectors
Official title: {Materials of die-attach connectors}
H10W72/351 (Materials of die-attach connectors) appears on 12,514 US grants and 14,422 published applications in this corpus.
Search patents in H10W- Granted patents
- 12,514
- Published applications
- 14,422
- Assignees
- 1,956
- Inventors
- 18,897
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 11 | 0 |
| 1978 | 8 | 0 |
| 1979 | 4 | 0 |
| 1980 | 11 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 10 | 0 |
| 1984 | 11 | 0 |
| 1985 | 12 | 0 |
| 1986 | 12 | 0 |
| 1987 | 19 | 0 |
| 1988 | 18 | 0 |
| 1989 | 25 | 0 |
| 1990 | 34 | 0 |
| 1991 | 41 | 0 |
| 1992 | 42 | 0 |
| 1993 | 33 | 0 |
| 1994 | 49 | 0 |
| 1995 | 46 | 0 |
| 1996 | 58 | 0 |
| 1997 | 67 | 0 |
| 1998 | 110 | 0 |
| 1999 | 115 | 0 |
| 2000 | 144 | 0 |
| 2001 | 151 | 73 |
| 2002 | 154 | 219 |
| 2003 | 158 | 196 |
| 2004 | 177 | 239 |
| 2005 | 184 | 314 |
| 2006 | 194 | 306 |
| 2007 | 197 | 347 |
| 2008 | 177 | 382 |
| 2009 | 211 | 409 |
| 2010 | 302 | 421 |
| 2011 | 331 | 480 |
| 2012 | 381 | 599 |
| 2013 | 471 | 598 |
| 2014 | 522 | 670 |
| 2015 | 625 | 777 |
| 2016 | 670 | 785 |
| 2017 | 714 | 783 |
| 2018 | 671 | 764 |
| 2019 | 792 | 932 |
| 2020 | 816 | 1138 |
| 2021 | 773 | 1041 |
| 2022 | 800 | 927 |
| 2023 | 738 | 594 |
| 2024 | 633 | 624 |
| 2025 | 498 | 528 |
| 2026 | 267 | 276 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009