H10W 72/353
Not comprising solid metals or solid metalloids
Official title: {not comprising solid metals or solid metalloids, e.g. ceramics}
H10W72/353 (Not comprising solid metals or solid metalloids) appears on 9,094 US grants and 10,350 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,094
- Published applications
- 10,350
- Assignees
- 1,516
- Inventors
- 14,091
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 10 | 0 |
| 1988 | 9 | 0 |
| 1989 | 15 | 0 |
| 1990 | 22 | 0 |
| 1991 | 31 | 0 |
| 1992 | 30 | 0 |
| 1993 | 26 | 0 |
| 1994 | 34 | 0 |
| 1995 | 29 | 0 |
| 1996 | 39 | 0 |
| 1997 | 56 | 0 |
| 1998 | 81 | 0 |
| 1999 | 92 | 0 |
| 2000 | 127 | 0 |
| 2001 | 128 | 58 |
| 2002 | 136 | 179 |
| 2003 | 136 | 160 |
| 2004 | 140 | 198 |
| 2005 | 150 | 245 |
| 2006 | 163 | 254 |
| 2007 | 167 | 281 |
| 2008 | 136 | 294 |
| 2009 | 168 | 316 |
| 2010 | 232 | 343 |
| 2011 | 263 | 370 |
| 2012 | 301 | 449 |
| 2013 | 345 | 436 |
| 2014 | 386 | 469 |
| 2015 | 437 | 543 |
| 2016 | 483 | 556 |
| 2017 | 520 | 570 |
| 2018 | 468 | 537 |
| 2019 | 556 | 659 |
| 2020 | 601 | 826 |
| 2021 | 521 | 711 |
| 2022 | 550 | 596 |
| 2023 | 520 | 373 |
| 2024 | 440 | 409 |
| 2025 | 328 | 356 |
| 2026 | 153 | 162 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314457 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011