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US 12,751,310 B2Granted
Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same
AssigneeFurukawa Electric Co., Ltd.
InventorsMinoru Morita, Yota Otani, Hiromitsu Maruyama
Life of this patent
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Abstract
A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a): (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 μg or less.
Claims8
A dicing die attach film, comprising:
- a dicing film, and
- a die attach film stacked on the dicing film,
- wherein the die attach film comprises an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and
- wherein an amount of the organic solvent in the die attach film satisfies the following (a):
- (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 μg or less,
- wherein the die attach film further comprises:
- an epoxy resin (A),
- an epoxy resin curing agent (B),
- a polymer component (C) comprising at least one of phenoxy resin and (meth)acrylic resin, and
- an inorganic filler (D), and
- wherein when the die attach film is heated at a temperature rising rate of 5° C./min from 25° C., a melt viscosity of the die attach film at 120° C. reaches a range of 500 to 10,000 Pa·s.
8 more elements
Dependencies are inferred from the claim text.