H10W 72/354
Comprising polymers
Official title: {comprising polymers}
H10W72/354 (Comprising polymers) appears on 8,481 US grants and 9,505 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,481
- Published applications
- 9,505
- Assignees
- 1,427
- Inventors
- 12,944
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 10 | 0 |
| 1988 | 8 | 0 |
| 1989 | 15 | 0 |
| 1990 | 21 | 0 |
| 1991 | 29 | 0 |
| 1992 | 29 | 0 |
| 1993 | 26 | 0 |
| 1994 | 34 | 0 |
| 1995 | 29 | 0 |
| 1996 | 39 | 0 |
| 1997 | 56 | 0 |
| 1998 | 81 | 0 |
| 1999 | 91 | 0 |
| 2000 | 127 | 0 |
| 2001 | 127 | 58 |
| 2002 | 136 | 177 |
| 2003 | 135 | 159 |
| 2004 | 140 | 196 |
| 2005 | 149 | 241 |
| 2006 | 161 | 249 |
| 2007 | 166 | 280 |
| 2008 | 132 | 288 |
| 2009 | 167 | 310 |
| 2010 | 227 | 337 |
| 2011 | 256 | 366 |
| 2012 | 300 | 433 |
| 2013 | 336 | 417 |
| 2014 | 373 | 440 |
| 2015 | 412 | 501 |
| 2016 | 451 | 521 |
| 2017 | 486 | 508 |
| 2018 | 428 | 490 |
| 2019 | 504 | 601 |
| 2020 | 550 | 738 |
| 2021 | 451 | 614 |
| 2022 | 489 | 524 |
| 2023 | 457 | 312 |
| 2024 | 385 | 336 |
| 2025 | 281 | 288 |
| 2026 | 122 | 121 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package with a non-conductive film having a flux comprising a dibenzocyclooctadiene (DBCOD)-based compound15 Sep 2026US 12,740,481 B2Samsung Electronics Co., Ltd.
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device1 Oct 2026US 2026/0305252 A1Resonac Corporation
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011