Back to results
US 12,740,481 B2Granted
Semiconductor package with a non-conductive film having a flux comprising a dibenzocyclooctadiene (DBCOD)-based compound
AssigneeSamsung Electronics Co., Ltd.
InventorsSeonho Lee, Myoungchul Eum
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a buffer die, a first core die disposed on the buffer die, and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF includes a dibenzocyclooctadiene (DBCOD)-based compound.
Claims12
A semiconductor package comprising:
- a buffer die;
- a first core die disposed on the buffer die;
- and
- a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other,
- wherein the NCF comprises a dibenzocyclooctadiene (DBCOD)-based compound, and
- wherein the NCF comprises a flux, and the flux comprises the DBCOD-based compound.
3 more elements
Dependencies are inferred from the claim text.