H10W 72/357
Multiple die-attach connectors having different materials
Official title: {Multiple die-attach connectors having different materials}
H10W72/357 (Multiple die-attach connectors having different materials) appears on 188 US grants and 259 published applications in this corpus.
Search patents in H10W- Granted patents
- 188
- Published applications
- 259
- Assignees
- 103
- Inventors
- 567
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 0 | 2 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 1 |
| 2006 | 2 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 5 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 0 | 2 |
| 2012 | 2 | 9 |
| 2013 | 8 | 9 |
| 2014 | 8 | 14 |
| 2015 | 12 | 14 |
| 2016 | 12 | 13 |
| 2017 | 14 | 11 |
| 2018 | 10 | 14 |
| 2019 | 11 | 19 |
| 2020 | 20 | 23 |
| 2021 | 19 | 28 |
| 2022 | 12 | 14 |
| 2023 | 18 | 15 |
| 2024 | 10 | 31 |
| 2025 | 13 | 19 |
| 2026 | 12 | 9 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package4 Aug 2026US 12,701,721 B2Samsung Electronics Co., Ltd.
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- Package with thermal conductive material interspersed in depopulated regions of solder bumps7 Jul 2026US 12,677,658 B2GLOBALFOUNDRIES U. S. Inc.
- Semiconductor devices and methods of manufacturing semiconductor devices13 Aug 2026US 2026/0240033 A1Amkor Technology Singapore Holding Pte.Ltd.
- Microelectronic structures including bridges30 Jul 2026US 2026/0223725 A1Intel Corporation
- Integrated circuit (ic) package having a package mold layer between a die and a substrate comprising two types of resin to improve coupling of die interconnects having different sizes25 Jun 2026US 2026/0182394 A1QUALCOMM Incorporated
- Semiconductor package and method of manufacturing the same18 Jun 2026US 2026/0173874 A1Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing semiconductor package28 May 2026US 2026/0150748 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Three dimensional device integration method and integrated device107US 6,984,571 B1Ziptronix, Inc. · 2006