Integrated circuit (ic) package having a package mold layer between a die and a substrate comprising two types of resin to improve coupling of die interconnects having different sizes

A method of fabricating an integrated circuit (IC) package, comprising:

• forming a die, comprising:
• a plurality of first die interconnects extending in a vertical direction;
• and
• a plurality of second die interconnects extending in the vertical direction;
• forming a substrate having a top surface and extending in a horizontal direction, comprising:
• forming an outer metallization layer, comprising:
• a first plurality of metal pads coupled to the plurality of first die interconnects in a first region of the top surface;
• and
• a second plurality of metal pads coupled to the plurality of second die interconnects in a second region of the top surface;
• and
• forming a package mold layer extending in the horizontal direction and between the substrate and the die, comprising:
• a first resin surrounding the plurality of first die interconnects;
• and
• a second resin surrounding the plurality of second die interconnects.