Semiconductor package and method of manufacturing semiconductor package

A semiconductor package, comprising:

• a substrate;
• a package structure disposed over the substrate;
• a plurality of die stacks disposed over the substrate and arranged on two opposite sides of the package structure;
• a ring structure disposed over the substrate and surrounding the package structure and the plurality of die stacks, wherein the ring structure comprises a flange portion extended over top surfaces of the plurality of die stacks;
• a lid structure covering and bonded to the package structure, the plurality of die stacks and the ring structure;
• and
• an adhesive bonded between a lower surface of the flange portion and the top surfaces of the plurality of die stacks.

A method of manufacturing a semiconductor package, comprising:

• providing a first semiconductor device over a substrate;
• providing a plurality of second semiconductor devices over the substrate;
• providing an adhesive on the substrate and top surfaces of the plurality of second semiconductor devices;
• bonding a ring structure over the substrate and the plurality of second semiconductor devices through the adhesive, wherein the ring structure surrounds the first semiconductor device and the plurality of second semiconductor devices and comprises a flange portion extended over and bonded to the top surfaces of the plurality of second semiconductor devices;
• and
• bonding a lid structure over the first semiconductor device, the plurality of second semiconductor devices, and an upper surface of the flange portion.