Semiconductor devices and methods of manufacturing semiconductor devices

A method, comprising:

• providing a subpanel substrate on a subpanel base, the subpanel substrate comprising a dielectric structure and a conductive structure, wherein the subpanel substrate comprises a singulated portion of a panel substrate;
• providing:
• a first electronic component on a first side of the subpanel substrate and electrically coupled to a first portion of the conductive structure, and
• a second electronic component on the first side of the subpanel substrate and electrically coupled to a second portion of the conductive structure;
• removing the subpanel base;
• providing:
• a first external interconnect on a second side of the subpanel substrate and electrically coupled to the first portion of the conductive structure, and
• a second external interconnect on the second side of the subpanel substrate and electrically coupled to the second portion of the conductive structure;
• and
• singulating the subpanel substrate to provide individual unit substrates.