H10W 72/352
Comprising metals or metalloids
Official title: {comprising metals or metalloids, e.g. solders}
H10W72/352 (Comprising metals or metalloids) appears on 7,097 US grants and 8,121 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,097
- Published applications
- 8,121
- Assignees
- 1,423
- Inventors
- 12,051
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 8 | 0 |
| 1985 | 10 | 0 |
| 1986 | 7 | 0 |
| 1987 | 13 | 0 |
| 1988 | 11 | 0 |
| 1989 | 17 | 0 |
| 1990 | 19 | 0 |
| 1991 | 26 | 0 |
| 1992 | 22 | 0 |
| 1993 | 19 | 0 |
| 1994 | 27 | 0 |
| 1995 | 25 | 0 |
| 1996 | 33 | 0 |
| 1997 | 35 | 0 |
| 1998 | 74 | 0 |
| 1999 | 80 | 0 |
| 2000 | 88 | 0 |
| 2001 | 100 | 44 |
| 2002 | 104 | 140 |
| 2003 | 95 | 117 |
| 2004 | 115 | 159 |
| 2005 | 110 | 180 |
| 2006 | 115 | 177 |
| 2007 | 115 | 211 |
| 2008 | 109 | 232 |
| 2009 | 123 | 249 |
| 2010 | 187 | 254 |
| 2011 | 194 | 309 |
| 2012 | 252 | 380 |
| 2013 | 299 | 360 |
| 2014 | 336 | 424 |
| 2015 | 374 | 442 |
| 2016 | 393 | 449 |
| 2017 | 401 | 463 |
| 2018 | 369 | 421 |
| 2019 | 439 | 501 |
| 2020 | 429 | 584 |
| 2021 | 413 | 512 |
| 2022 | 397 | 486 |
| 2023 | 343 | 313 |
| 2024 | 336 | 306 |
| 2025 | 238 | 254 |
| 2026 | 156 | 154 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Submounts with stud protrusions for semiconductor packages29 Sep 2026US 12,751,305 B2
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Stretchable form of single crystal silicon for high performance electronics on rubber substrates525US 7,521,292 B2The Board of Trustees of the University of Illinois · 2009
- Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof505US 6,962,867 B2MicronTechnology, Inc. · 2005
- Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies495US 6,800,930 B2Micron Technology, Inc. · 2004
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999