H10W 72/3528
Intermetallic compounds
Official title: {Intermetallic compounds}
H10W72/3528 (Intermetallic compounds) appears on 201 US grants and 258 published applications in this corpus.
Search patents in H10W- Granted patents
- 201
- Published applications
- 258
- Assignees
- 95
- Inventors
- 452
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 3 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 5 |
| 2007 | 4 | 7 |
| 2008 | 2 | 5 |
| 2009 | 3 | 5 |
| 2010 | 5 | 2 |
| 2011 | 6 | 15 |
| 2012 | 6 | 4 |
| 2013 | 8 | 14 |
| 2014 | 14 | 17 |
| 2015 | 12 | 10 |
| 2016 | 8 | 16 |
| 2017 | 15 | 18 |
| 2018 | 14 | 18 |
| 2019 | 13 | 12 |
| 2020 | 11 | 26 |
| 2021 | 20 | 20 |
| 2022 | 6 | 8 |
| 2023 | 18 | 14 |
| 2024 | 13 | 15 |
| 2025 | 12 | 17 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and semiconductor package including the same11 Aug 2026US 12,707,569 B2Samsung Electronics Co., Ltd.
- Delamination/cracking improvement at solder joints in microelectronics package14 Jul 2026US 12,685,205 B2Qorvo US, Inc.
- Semiconductor device including a substrate to which a lead is fixed7 Jul 2026US 12,677,714 B2Rohm Co., Ltd.
- Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures28 Apr 2026US 12,616,039 B2Infineon Technologies AG
- Method of forming an interconnection between an electric component and an electronic component17 Mar 2026US 12,581,981 B2Infineon Technologies Austria AG
- Delamination/cracking improvement at solder joints in microelectronics package1 Oct 2026US 2026/0305441 A1Qorvo US, Inc.
- Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures6 Aug 2026US 2026/0231787 A1Infineon Technologies AG
- Method of Forming an Interconnection between an Electric Component and an Electronic Component4 Jun 2026US 2026/0157209 A1Infineon Technologies Austria AG
- Semiconductor devices and methods of manufacturing semiconductor devices14 May 2026US 2026/0136952 A1Amkor Technology Singapore Holding Pte.Ltd.
- Laminated structure, quantum device, and method of manufacturing laminated structure9 Apr 2026US 2026/0101678 A1Fujitsu Limited
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials229US 6,335,263 B12002
- Nickel tin bonding system with barrier layer for semiconductor wafers and devices198US 7,910,945 B2Cree, Inc. · 2011
- Light emitting diode display with redundancy scheme127US 9,865,832 B2Apple Inc. · 2018
- Method of fabricating a light emitting diode display with integrated defect detection test122US 9,252,375 B2LuxVue Technology Corporation · 2016