Printed circuit board and semiconductor package including the same

A semiconductor package comprising:

• a printed circuit board (PCB);
• a die disposed on the PCB and connected to the PCB;
• and
• a plurality of connection terminals disposed on the PCB,
• wherein the PCB includes:
• a substrate body part including a first side and a second side that are opposite to each other in a first direction;
• first upper redistribution patterns disposed on the first side of the substrate body part;
• second upper redistribution patterns disposed on the first side of the substrate body part;
• a first solder resist film disposed on the first side of the substrate body part and including first recesses and second recesses that expose upper surfaces of the first upper redistribution patterns and upper surfaces of the second upper redistribution patterns;
• wire patterns connecting pads of the die to the first upper redistribution patterns;
• and
• dummy wire patterns disposed in the second recesses and connected to the second upper redistribution patterns,
• wherein the first upper redistribution patterns and the second upper redistribution patterns are electrically connected to one another.

A semiconductor package comprising:

• a printed circuit board (PCB);
• a die disposed on the PCB and connected to the PCB;
• and
• a plurality of connection terminals connected to the PCB,
• wherein the PCB includes:
• a substrate body part including a first side and a second side that are opposite to each other in a first direction;
• upper redistribution patterns disposed on the first side of the substrate body part;
• connection patterns disposed on sides of the upper redistribution patterns;
• a first solder resist film disposed on the first side of the substrate body part and including recesses that expose upper surfaces of the upper redistribution patterns;
• and
• wire patterns partially disposed in the recesses and connecting pads of the die to the upper redistribution patterns,
• wherein a depth of each of the connection patterns in the first direction is substantially the same as a depth of each of the upper redistribution patterns in the first direction, and
• a width of each of the connection patterns in a second direction, which intersects the first direction, is smaller than a width of each of the upper redistribution patterns in the second direction.