Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures

A method of manufacturing an electronic system, wherein the method comprises:

• connecting an at least partially electrically conductive carrier with an electronic component by an intermetallic connection structure;
• and
• forming the intermetallic connection structure with:
• an intermetallic mesh structure comprising a plurality of interconnected filaments each formed by a sequence of directly connected metallic particles of at least three different metallic chemical elements in a central portion of the intermetallic connection structure;
• a metallic matrix of another metallic material different from the at least three different metallic chemical elements;
• and
• opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier and the electronic component, the filaments embedded within the metallic matrix and forming continuously electrically conductive vertical paths between the opposing exterior structures to electrically connect the electronic component to the carrier.