Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures
AssigneeInfineon Technologies AG
InventorsChee Yang Ng, Edmund Riedl, Joseph Victor Soosai Prakasam
Life of this patent
Estimating the term…
Abstract
An electronic system is disclosed. In one example, the electronic system comprises an at least partially electrically conductive carrier, an electronic component, and an intermetallic connection structure connecting the carrier and the component. The intermetallic connection structure comprising an intermetallic mesh structure in a central portion of the intermetallic connection structure, and opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier or the component.
Claims18
An electronic system, wherein the electronic system comprises:
- an at least partially electrically conductive carrier;
- an electronic component;
- and
- an intermetallic connection structure connecting the carrier and the component and comprising:
- an intermetallic mesh structure comprising a plurality of interconnected filaments each formed by a sequence of directly connected metallic particles of at least three different metallic chemical elements in a central portion of the intermetallic connection structure;
- a metallic matrix of another metallic material different from the at least three different metallic chemical elements;
- and
- opposing exterior structures without intermetallic mesh and each arranged between the intermetallic mesh structure and the carrier and the electronic component, the filaments embedded within the metallic matrix and forming continuously electrically conductive vertical paths between the opposing exterior structures to electrically connect the electronic component to the carrier.
Dependencies are inferred from the claim text.