Laminated structure, quantum device, and method of manufacturing laminated structure

A laminated structure comprising:

• a cooling member;
• a circuit board provided on the cooling member and formed with a through hole;
• a device provided on the circuit board and including a quantum bit;
• and
• a bonding material configured to bond the circuit board and the device to each other, wherein
• the bonding material includes:
• a first bonding portion in contact with a portion of an upper surface of the cooling member exposed from the through hole, an upper surface of the circuit board, and a lower surface of the device;
• and
• a second bonding portion provided around the first bonding portion in plan view and in contact with at least the upper surface of the circuit board and the lower surface of the device, and wherein
• a thermal conductivity of the first bonding portion is higher than a thermal conductivity of the second bonding portion, and
• an elastic modulus of the second bonding portion is lower than an elastic modulus of the first bonding portion.