Method of forming an interconnection between an electric component and an electronic component

A method of forming an interconnection, the method comprising:

• providing an electronic component comprising a first main face, and a first metallic layer disposed on the first main face;
• providing an electric component comprising a second main face and a second metallic layer disposed on the second main face, at least one of the first or second metallic layers comprising an oxide layer provided on a main face thereof;
• disposing a reducing agent on one or both of the electronic component and the electric component such that the reducing agent is enabled to remove the oxide layer;
• and
• connecting the electronic component to the electric component by directly connecting the first metallic layer of the electronic component with the second metallic layer of the electric component by applying pressure and heat,
• wherein the first and second metallic layers have a different malleability,
• wherein the first metallic layer comprises a first surface roughness and the second metallic layer comprises a second surface roughness which is different from the first surface roughness.