Method of Forming an Interconnection between an Electric Component and an Electronic Component
AssigneeInfineon Technologies Austria AG
InventorAlexander Heinrich
Life of this patent
Estimating the term…
Abstract
An arrangement for a direct interconnect assembly includes an electronic component including a first main face and a first metallic layer disposed on the first main face; and an electric component comprising a second main face and a second metallic layer disposed on the second main face, wherein the electronic component is connected to the electric component, wherein the first metallic layer of the electronic component is directly connected with the second metallic layer of the electric component, wherein the first and second metallic layers are essentially free of oxygen.
Claims15
An arrangement for a direct interconnect assembly, the arrangement comprising:
- an electronic component comprising a first main face and a first metallic layer disposed on the first main face;
- and
- an electric component comprising a second main face and a second metallic layer disposed on the second main face,
- wherein the electronic component is connected to the electric component,
- wherein the first metallic layer of the electronic component is directly connected with the second metallic layer of the electric component,
- wherein the first and second metallic layers are essentially free of oxygen.
Dependencies are inferred from the claim text.