H10W 72/3524
Eutectic alloys
Official title: {Eutectic alloys}
H10W72/3524 (Eutectic alloys) appears on 92 US grants and 111 published applications in this corpus.
Search patents in H10W- Granted patents
- 92
- Published applications
- 111
- Assignees
- 76
- Inventors
- 215
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 3 |
| 2005 | 2 | 6 |
| 2006 | 2 | 3 |
| 2007 | 1 | 4 |
| 2008 | 1 | 10 |
| 2009 | 3 | 9 |
| 2010 | 6 | 6 |
| 2011 | 4 | 9 |
| 2012 | 4 | 5 |
| 2013 | 9 | 5 |
| 2014 | 9 | 7 |
| 2015 | 9 | 12 |
| 2016 | 8 | 9 |
| 2017 | 5 | 1 |
| 2018 | 2 | 3 |
| 2019 | 4 | 1 |
| 2020 | 2 | 4 |
| 2021 | 1 | 5 |
| 2022 | 2 | 4 |
| 2023 | 4 | 3 |
| 2024 | 2 | 1 |
| 2025 | 4 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Delamination/cracking improvement at solder joints in microelectronics package14 Jul 2026US 12,685,205 B2Qorvo US, Inc.
- Heterogeneous chip integration of III-nitride-based materials for optoelectronic device arrays in the visible and ultraviolet12 May 2026US 12,628,467 B2The Board of Trustees of the University of Illinois
- Liquid metal thermal interface21 Oct 2025US 12,451,402 B2Indium Corporation
- Microelectronic structures including bridges9 Sep 2025US 12,412,842 B2Intel Corporation
- Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined9 Sep 2025US 12,412,861 B2Mitsubishi Electric Corporation
- Delamination/cracking improvement at solder joints in microelectronics package1 Oct 2026US 2026/0305441 A1Qorvo US, Inc.
- Phase changing thermal interface material alloy created in-situ18 Jul 2024US 2024/0243091 A1Indium Corporation of America
- Microelectronic structures including bridges28 Dec 2023US 2023/0420376 A1Intel Corporation
- Delamination/cracking improvement at solder joints in microelectronics package12 Oct 2023US 2023/0326899 A1Qorvo US, Inc.
- Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined23 Feb 2023US 2023/0054798 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Direct die attach utilizing heated bond head94US 7,854,365 B2ASM Assembly Automation Ltd. · 2010
- Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes76US 5,378,926 AHughes Aircraft Company · 1995
- Plastic molded type semiconductor device67US 5,057,906 AKabushiki Kaisha Toshiba · 1991
- Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant59US 8,558,392 B2STATS ChipPAC, Ltd. · 2013
- Semiconductor package including an embedded surface mount device and method of forming the same53US 9,196,586 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015