Liquid metal thermal interface
AssigneeIndium Corporation
InventorRoss B. Berntson
Life of this patent
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Abstract
Liquid metal thermal interface materials and their uses in electronics assembly are described. In one implementation, a semiconductor assembly includes: a semiconductor die; a heat exchanger; and a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without using a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger. The TIM alloy may be formed by placing a TIM material between the semiconductor die and the heat exchanger, the TIM material comprising a first liquid metal foam in touching relation with the surface of the semiconductor die, a second liquid metal foam in touching relation with the surface of the heat exchanger.
Claims15
A semiconductor assembly, comprising:
- a semiconductor die;
- a heat exchanger;
- and
- a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger, the TIM alloy comprising:
- a first liquid metal foam in touching relation with the surface of the semiconductor die,
- a second liquid metal foam in touching relation with the surface of the heat exchanger, and
- a thermally conductive metal foil between and in touching relation with the first liquid metal foam and the second liquid metal foam, the thermally conductive metal foil comprising multiple first regions and multiple second regions, the first regions having a first thickness and the second regions having a second thickness greater than the first thickness and forming a patterned surface on the thermally conductive metal foil.
A semiconductor assembly, comprising:
- a semiconductor die;
- a heat exchanger;
- and
- a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger, the TIM alloy comprising:
- a first liquid metal in touching relation with the surface of the semiconductor die,
- a second liquid metal in touching relation with the surface of the heat exchanger, and
- a thermally conductive metal foil between and in touching relation with the first liquid metal and the second liquid metal, the thermally conductive metal foil comprising multiple first regions and multiple second regions, the first regions having a first thickness and the second regions having a second thickness greater than the first thickness and forming a patterned surface on the thermally conductive metal foil.
Dependencies are inferred from the claim text.