Semiconductor package including an embedded surface mount device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ying-Ju Chen, Ming-Yen Chiu, Der-Chyang Yeh
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Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.
Claims20
A semiconductor package comprising:
- a first package comprising one or more dies;
- a package substrate bonded to a first side of the first package by a first set of connectors;
- a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices;
- and
- a second package bonded to a second side of the first package by a second set of conductive connectors, the second side being opposite the first side, the second package comprising one or more dies.
A semiconductor package comprising:
- a first package comprising:
- a first die having a first side and a second side, the second side being opposite the first side;
- an interconnect structure over the first side of the first die, the interconnect structure comprising N number of metal layers and M number of passivation layers;
- a surface mount device being mounted to one of the N metal layers in a first portion of the interconnect structure, the first portion having less than M number of passivation layers;
- and
- a set of under bump metallizations (UBMs) coupled to the Nth metal layer of the interconnect structure of the first package, the Nth metal layer being the furthest metal layer from the first side of the first die;
- a first set of conductive connectors coupled to the set of UBMs;
- and
- a package substrate bonded to the first set of conductive connectors.
A method comprising:
- forming a first package comprising:
- forming an interconnect structure over a first side of a first die;
- recessing a portion of the interconnect structure, wherein recessing the portion of the interconnect structure further comprises removing at least one passivation layer from the portion of the interconnect structure;
- and
- mounting a surface mount device in the recessed portion of the interconnect structure;
- and
- bonding the interconnect structure of the first package to a package substrate using a first set of conductive connectors.
Dependencies are inferred from the claim text.