Microelectronic structures including bridges

A microelectronic assembly, comprising:

• a substrate including a first metal layer and a second metal layer, wherein a face of the substrate includes first conductive contacts;
• a cavity in the substrate, wherein a portion of the first metal layer in the substrate, and a portion of the second metal layer in the substrate, are exposed in the cavity, and wherein the portion of the first metal layer at least partially overlaps the portion of the second metal layer;
• a bridge component in the cavity, wherein the bridge component includes a first face and an opposing second face, wherein the second face of the bridge component is between the first face of the bridge component and a bottom surface of the cavity in the substrate, wherein the portion of the first metal layer is between the second face of the bridge component and the portion of the second metal layer, wherein the bridge component includes second conductive contacts at the first face and a third conductive contact at the second face, and wherein the third conductive contact is directly coupled to the portion of the second metal layer by solder;
• and
• a microelectronic component having a face including fourth conductive contacts, wherein some of the fourth conductive contacts of the microelectronic component are conductively coupled to the first conductive contacts of the substrate, and wherein some of the fourth conductive contacts of the microelectronic component are conductively coupled to the second conductive contacts at the first face of the bridge component.

A microelectronic assembly, comprising:

• a substrate including a first metal layer and a second metal layer, wherein a face of the substrate includes first conductive contacts;
• a cavity in the substrate, wherein a portion of the first metal layer in the substrate, and a portion of the second metal layer in the substrate, are exposed in the cavity, and wherein the portion of the first metal layer at least partially overlaps the portion of the second metal layer;
• a bridge component in the cavity, wherein the bridge component includes a first face and an opposing second face, wherein the second face of the bridge component is between the first face of the bridge component and a bottom surface of the cavity in the substrate, wherein the portion of the first metal layer is between the second face of the bridge component and the portion of the second metal layer, wherein the bridge component includes second conductive contacts at the first face and a third conductive contact at the second face, and wherein the third conductive contact is directly coupled to the portion of the second metal layer by solder;
• a first microelectronic component having a face including fourth conductive contacts, wherein some of the fourth conductive contacts of the first microelectronic component are conductively coupled to the first conductive contacts of the substrate, and wherein some of the fourth conductive contacts of the first microelectronic component are conductively coupled to the second conductive contacts at the first face of the bridge component;
• and
• a second microelectronic component having a face including fifth conductive contacts, wherein some of the fifth conductive contacts of the second microelectronic component are conductively coupled to first conductive contacts of the substrate, and wherein some of the fifth conductive contacts of the second microelectronic component are conductively coupled to second conductive contacts at the first face of the bridge component.