Direct die attach utilizing heated bond head
AssigneeASM Assembly Automation Ltd.
InventorsMing Li, Ying Ding, Ping Liang Tu, King Ming Lo, Kwok Kee Chung
Life of this patent
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Abstract
A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.
Claims14
Method of bonding a die comprising a solder layer which has a melting point Tm, comprising the steps of:
- heating a bond head to at least a bond head setting temperature T1, which is higher than Tm;
- heating a substrate to a substrate setting temperature T2, which is lower than Tm;
- picking up the die with the heated bond head and heating the die with the heated bond head to at least T1 so as to melt the solder layer thereof;
- placing the die on the substrate after melting the solder layer by heating the die with the heated bond head;
- pressing the molten solder layer of the die onto the substrate so as to bond the die to the substrate;
- and thereafter
- separating the bond head from the die so that the solder layer is cooled to at least T2 and solidifies.
Dependencies are inferred from the claim text.