Plastic molded type semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorToshio Ishigami
Life of this patent
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Abstract
A first high-power element chip having high current consumption is mounted and fixed of a first bed portion on a heat radiating fin by soldering. A second high-power element chip is mounted and fixed by high-temperature die bonding on a second bed portion formed by denting a part of one end of a lead frame made of a metal thin plate, and an insulating paste is filled between the lower surface of the second bed portion and the upper surface of the first bed portion. In addition, a logic element chip is mounted and fixed on one end of another lead frame made of a metal thin plate by a conductive adhesive such as a silver paste.
Claims4
A plastic molded type semiconductor device comprising:
- a first semiconductor chip mounting region formed on a radiation fin;
- a first semiconductor chip mounted on said first semiconductor chip mounting region by an adhesive member;
- a first lead frame with an end portion located on said radiation fin;
- a second semiconductor chip mounting region formed of a part of said first lead frame, said part being bent toward the first semiconductor chip mounting region;
- a second semiconductor chip mounted on said second semiconductor chip mounting region via a first conductive adhesive member;
- an insulating member provided between and thermally bonded to a lower surface of said second semiconductor chip mounting region and an upper surface of said first semiconductor chip mounting region;
- a second lead frame distinct from said radiation fin;
- a third semiconductor chip mounted on said second lead frame via a second conductive adhesive member;
- and
- a plastic molded member for housing said first, second, and third semiconductor chips therein.
Dependencies are inferred from the claim text.