H10W 72/90
Bond pads, in general
H10W72/90 (Bond pads, in general) appears on 45,156 US grants and 50,155 published applications in this corpus.
Search patents in H10W- Granted patents
- 45,156
- Published applications
- 50,155
- Assignees
- 3,799
- Inventors
- 44,789
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 24 | 0 |
| 1978 | 17 | 0 |
| 1979 | 16 | 0 |
| 1980 | 17 | 0 |
| 1981 | 18 | 0 |
| 1982 | 14 | 0 |
| 1983 | 13 | 0 |
| 1984 | 23 | 0 |
| 1985 | 33 | 0 |
| 1986 | 38 | 0 |
| 1987 | 42 | 0 |
| 1988 | 40 | 0 |
| 1989 | 64 | 0 |
| 1990 | 93 | 0 |
| 1991 | 126 | 0 |
| 1992 | 132 | 0 |
| 1993 | 142 | 0 |
| 1994 | 187 | 0 |
| 1995 | 183 | 0 |
| 1996 | 212 | 0 |
| 1997 | 230 | 0 |
| 1998 | 364 | 0 |
| 1999 | 468 | 0 |
| 2000 | 694 | 0 |
| 2001 | 879 | 520 |
| 2002 | 1158 | 1445 |
| 2003 | 1281 | 1500 |
| 2004 | 1299 | 1650 |
| 2005 | 1201 | 1817 |
| 2006 | 1195 | 1716 |
| 2007 | 1173 | 1842 |
| 2008 | 1047 | 2038 |
| 2009 | 1124 | 1900 |
| 2010 | 1624 | 2030 |
| 2011 | 1726 | 1831 |
| 2012 | 1706 | 1853 |
| 2013 | 1810 | 1841 |
| 2014 | 1870 | 1996 |
| 2015 | 1921 | 2244 |
| 2016 | 2108 | 2064 |
| 2017 | 2149 | 2097 |
| 2018 | 1888 | 1991 |
| 2019 | 1952 | 2229 |
| 2020 | 2115 | 2734 |
| 2021 | 2058 | 2626 |
| 2022 | 2004 | 2607 |
| 2023 | 2028 | 2242 |
| 2024 | 1922 | 2435 |
| 2025 | 1661 | 1911 |
| 2026 | 1054 | 996 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor memory device6 Oct 2026US 12,757,413 B2Samsung Electronics Co., Ltd.
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Light emitting display device6 Oct 2026US 12,757,494 B2Samsung Display Co., Ltd.
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of forming the same8 Oct 2026US 2026/0314076 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015