H10W 72/921
Structures or relative sizes of bond pads
Official title: {Structures or relative sizes of bond pads}
H10W72/921 (Structures or relative sizes of bond pads) appears on 17,170 US grants and 19,902 published applications in this corpus.
Search patents in H10W- Granted patents
- 17,170
- Published applications
- 19,902
- Assignees
- 1,831
- Inventors
- 20,798
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 8 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 8 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 10 | 0 |
| 1988 | 11 | 0 |
| 1989 | 10 | 0 |
| 1990 | 17 | 0 |
| 1991 | 28 | 0 |
| 1992 | 34 | 0 |
| 1993 | 23 | 0 |
| 1994 | 32 | 0 |
| 1995 | 46 | 0 |
| 1996 | 53 | 0 |
| 1997 | 59 | 0 |
| 1998 | 83 | 0 |
| 1999 | 109 | 0 |
| 2000 | 170 | 0 |
| 2001 | 228 | 126 |
| 2002 | 307 | 346 |
| 2003 | 326 | 422 |
| 2004 | 335 | 470 |
| 2005 | 333 | 637 |
| 2006 | 408 | 835 |
| 2007 | 415 | 746 |
| 2008 | 463 | 1034 |
| 2009 | 457 | 697 |
| 2010 | 722 | 996 |
| 2011 | 752 | 705 |
| 2012 | 755 | 821 |
| 2013 | 784 | 792 |
| 2014 | 765 | 840 |
| 2015 | 852 | 966 |
| 2016 | 904 | 854 |
| 2017 | 921 | 896 |
| 2018 | 798 | 809 |
| 2019 | 809 | 910 |
| 2020 | 834 | 1031 |
| 2021 | 811 | 1082 |
| 2022 | 797 | 1076 |
| 2023 | 826 | 849 |
| 2024 | 796 | 853 |
| 2025 | 665 | 723 |
| 2026 | 369 | 386 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/923Bond pads having multiple stacked layers11,901
- H10W 72/926Multiple bond pads having different sizes4,855
- H10W 72/922Bond pads being integral with underlying chip-level interconnections4,114
- H10W 72/925Bond pads having a filler embedded in a matrix226
- H10W 72/924Bond pads having multiple side-by-side cores59
- H10W 72/927Multiple bond pads having different structures31
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By later US patents
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