Semiconductor device and method of fabricating semiconductor package

A method of fabricating a semiconductor package, comprising:

• forming an electronic integrated circuit die, comprising:
• providing a semiconductor structure;
• forming an interconnection layer on the semiconductor structure;
• forming a passivation layer on the interconnection layer;
• patterning the interconnection layer to form an opening portion revealing the semiconductor structure, and removing portions of the semiconductor structure to form a concaved portion in the semiconductor structure;
• forming a protection film on the interconnection layer over the passivation layer, and on sidewalls of the opening portion, wherein the protection film is further formed on the concaved portion of the semiconductor structure;
• forming a gap fill material in the opening portion of the interconnection layer and surrounded by the interconnection layer;
• forming a plurality of first bonding pads on the protection film;
• bonding a photonic integrated circuit die to the electronic integrated circuit die, wherein the photonic integrated circuit die comprises:
• a photonic layer overlapped with the opening portion of the interconnection layer;
• and
• a plurality of second bonding pads disposed over the photonic layer, wherein the plurality of second bonding pads is bonded to the plurality of first bonding pads.