H10W 72/923
Bond pads having multiple stacked layers
Official title: {Bond pads having multiple stacked layers}
H10W72/923 (Bond pads having multiple stacked layers) appears on 11,901 US grants and 13,823 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,901
- Published applications
- 13,823
- Assignees
- 1,444
- Inventors
- 15,401
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 9 | 0 |
| 1990 | 12 | 0 |
| 1991 | 19 | 0 |
| 1992 | 25 | 0 |
| 1993 | 18 | 0 |
| 1994 | 26 | 0 |
| 1995 | 37 | 0 |
| 1996 | 38 | 0 |
| 1997 | 43 | 0 |
| 1998 | 61 | 0 |
| 1999 | 80 | 0 |
| 2000 | 123 | 0 |
| 2001 | 175 | 92 |
| 2002 | 244 | 276 |
| 2003 | 263 | 336 |
| 2004 | 269 | 378 |
| 2005 | 265 | 502 |
| 2006 | 320 | 700 |
| 2007 | 329 | 595 |
| 2008 | 390 | 898 |
| 2009 | 364 | 497 |
| 2010 | 570 | 830 |
| 2011 | 596 | 506 |
| 2012 | 564 | 537 |
| 2013 | 537 | 532 |
| 2014 | 545 | 542 |
| 2015 | 545 | 620 |
| 2016 | 586 | 564 |
| 2017 | 635 | 622 |
| 2018 | 518 | 513 |
| 2019 | 523 | 575 |
| 2020 | 535 | 682 |
| 2021 | 521 | 662 |
| 2022 | 489 | 589 |
| 2023 | 508 | 498 |
| 2024 | 462 | 530 |
| 2025 | 380 | 492 |
| 2026 | 224 | 255 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Light emitting display device6 Oct 2026US 12,757,494 B2Samsung Display Co., Ltd.
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of fabricating semiconductor package8 Oct 2026US 2026/0314476 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Dummy structure for chip-on-wafer-on-substrate961US 9,425,126 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009