Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorJIHOON KIM
Life of this patent
Estimating the term…
Abstract
A method for fabricating a semiconductor package includes forming a lower structure including a first semiconductor substrate and a lower through structure penetrating the first semiconductor substrate, forming a lower curved pad on the lower through structure, forming an upper structure including a second semiconductor substrate and an upper through structure penetrating the second semiconductor substrate, forming an upper curved pad connected to the upper through structure, and bonding the lower structure and the upper structure such that the upper curved pad is positioned on the lower curved pad, where a top surface of the lower curved pad includes a curved surface and a bottom surface of the upper curved pad includes a curved surface.
Claims20
A method for fabricating a semiconductor package, comprising:
- forming a lower structure comprising a first semiconductor substrate and a lower through structure penetrating the first semiconductor substrate;
- forming a lower curved pad on the lower through structure;
- forming an upper structure comprising a second semiconductor substrate and an upper through structure penetrating the second semiconductor substrate;
- forming an upper curved pad connected to the upper through structure;
- and
- bonding the lower structure and the upper structure such that the upper curved pad is positioned on the lower curved pad,
- wherein a top surface of the lower curved pad comprises a curved surface, and
- wherein a bottom surface of the upper curved pad comprises a curved surface.
A method for fabricating a semiconductor package, comprising:
- forming a lower structure having a lower curved pad connected to a lower through structure penetrating a first semiconductor substrate;
- forming an upper structure having an upper curved pad connected to an upper through structure penetrating a second semiconductor substrate;
- and
- bonding the lower structure and the upper structure such that the lower curved pad and the upper curved pad are mated and contact each other, to form a connection structure connecting the first semiconductor substrate and the second semiconductor substrate,
- wherein the lower curved pad has a top surface having a downwardly concave curved surface, and
- wherein the upper curved pad has a bottom surface having a curved surface corresponding to the curved surface of the top surface of the lower curved pad.
A method for fabricating a semiconductor package, comprising:
- providing a carrier substrate, a tape on the carrier substrate, and a base dielectric layer on the tape, a first semiconductor substrate on the base dielectric layer, a lower through structure penetrating the first semiconductor substrate, a lower dielectric layer covering a top surface of a lower through structure;
- forming a preliminary intervening layer on the lower dielectric layer;
- removing a portion of the lower dielectric layer and a portion of the preliminary intervening layer to expose the top surface of the lower through structure;
- forming a preliminary curved dielectric layer on the exposed top surface, on the lower dielectric layer, and on the preliminary intervening layer;
- forming a trench exposing the top surface of the lower through structure by removing a portion of the lower dielectric layer, a portion of the preliminary intervening layer, and a portion of the preliminary curved dielectric layer;
- forming a preliminary pad layer filling the trench;
- etching the preliminary pad layer and the preliminary curved dielectric layer to form a first curved dielectric layer having a lower curved surface and to form a lower curved pad in the trench, a top surface of the lower curved pad comprising a curved surface;
- and
- bonding an upper structure, which comprises an upper through structure penetrating a second semiconductor substrate and an upper curved pad connected to the upper through structure, such that the upper curved pad is positioned on the lower curved pad,
- wherein a bottom surface of the upper curved pad comprises a curved surface.
Dependencies are inferred from the claim text.