Integrated circuit structure and manufacturing method thereof

Abstract

A semiconductor package includes an integrated circuit, an interposer, and a package substrate. The integrated circuit includes a semiconductor substrate, a seal ring over a periphery of the semiconductor substrate, a passivation layer over the semiconductor substrate and covering the seal ring, a first protective layer over the passivation layer, a second protective layer over the first protective layer and covering a boundary of the first protective layer. The interposer includes a substrate and a plurality of through vias extending through the substrate. The integrated circuit is disposed over the interposer, and the interposer carrying the integrated circuit is mounted over the package substrate.

Dependencies are inferred from the claim text.