H10W 72/925
Bond pads having a filler embedded in a matrix
Official title: {Bond pads having a filler embedded in a matrix}
H10W72/925 (Bond pads having a filler embedded in a matrix) appears on 226 US grants and 312 published applications in this corpus.
Search patents in H10W- Granted patents
- 226
- Published applications
- 312
- Assignees
- 112
- Inventors
- 548
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 2 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 33 |
| 2008 | 0 | 6 |
| 2009 | 1 | 2 |
| 2010 | 3 | 4 |
| 2011 | 2 | 0 |
| 2012 | 1 | 6 |
| 2013 | 2 | 9 |
| 2014 | 11 | 11 |
| 2015 | 12 | 10 |
| 2016 | 8 | 16 |
| 2017 | 14 | 24 |
| 2018 | 19 | 18 |
| 2019 | 16 | 24 |
| 2020 | 24 | 26 |
| 2021 | 20 | 33 |
| 2022 | 21 | 27 |
| 2023 | 26 | 18 |
| 2024 | 22 | 18 |
| 2025 | 14 | 13 |
| 2026 | 6 | 8 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Semiconductor dies including recesses for facilitating mechanical debonding, and associated systems and devices4 Aug 2026US 12,702,061 B2Micron Technology, Inc.
- Substrate bonding method7 Jul 2026US 12,677,655 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects21 Apr 2026US 12,610,851 B2STATS ChipPAC Pte. Ltd.
- Structures for low temperature bonding using nanoparticles24 Feb 2026US 12,564,086 B2Adeia Semiconductor Technologies LLC
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Chip package structure with heat conductive layer30 Apr 2026US 2026/0123416 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Logic drive with brain-like elasticity and integrality based on standard commodity fpga ic chips using non-volatile memory cells12 Feb 2026US 2026/0045951 A1iCometrue Company Ltd.
- Systems and methods for direct bonding in semiconductor die manufacturing5 Feb 2026US 2026/0040985 A1Micron Technology, Inc.
Most cited
By later US patents
- Stacked dies and methods for forming bonded structures214US 10,204,893 B2Invensas Bonding Technologies, Inc. · 2019
- Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment165US 6,608,371 B2Seiko Epson Corporation · 2003
- Multi-chip structure and method of forming same33US 9,653,433 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Multi-chip structure and method of forming same25US 9,324,698 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Solderable contact regions22US 8,975,175 B1SunPower Corporation · 2015