Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing
OwnerYe Zhuang, Xiao Lin Kang +2inventors
InventorsYe Zhuang, Xiao Lin Kang, Yu Yang, Yajun Zhang
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Abstract
A semiconductor die may include a bond pad and a wire attached to the bond pad by an intermetallic compound. A first portion of the wire in direct contact with the bond pad has a first perimeter, a second portion of the wire not in direct contact with the bond pad has a second perimeter that is smaller than the first perimeter, a third portion of the wire between the first portion and the second portion has a third perimeter, and a first Euclidean distance between two opposing points on the third perimeter is longer than a second Euclidean distance between two other opposing points on the third perimeter.
Claims20
A semiconductor package comprising:
- a semiconductor die including a bond pad;
- and
- a wire attached to the bond pad by an intermetallic compound, wherein:
- a first portion of the wire in direct contact with the bond pad has a first perimeter,
- a second portion of the wire not in direct contact with the bond pad has a second perimeter that is smaller than the first perimeter,
- a third portion of the wire between the first portion and the second portion has a third perimeter, and
- a first Euclidean distance between two opposing points on the third perimeter is longer than a second Euclidean distance between two other opposing points on the third perimeter.
A semiconductor package, comprising:
- a semiconductor die having a first bond pad;
- a substrate having a second bond pad;
- and
- a wire coupling the first bond pad and the second bond pad, the wire having a first end at the first bond pad and a second end at the second bond pad, wherein:
- the first end is a ball-bond having a circular perimeter,
- the second end is a wedge-bond, and
- the ball-bond is mechanically coupled to the first bond pad by intermetallic compound having a noncircular perimeter, wherein a first Euclidean distance between two opposing points on the noncircular perimeter is longer than a second Euclidean distance between two other opposing points on the noncircular perimeter.
A method of making a semiconductor package, the method comprising:
- aligning a hollow capillary head over a bond pad on a semiconductor die, wherein:
- the hollow capillary head has a first end and a second end with an outer surface and an inner surface between the first end and the second end,
- the inner surface has a first portion, a second portion and a third portion,
- the third portion is between the first end and the second portion,
- the second portion is between the third portion and the first portion,
- the first portion has a smaller diameter at the second portion than at the second end, and
- the third portion has a noncircular perimeter at the first end, wherein a first Euclidean distance between two opposing points on the noncircular perimeter is longer than a second Euclidean distance between two other opposing points on the noncircular perimeter;
- feeding a wire through the hollow capillary head to extend outside the first end;
- forming a ball at a tip of the wire outside the first end of the hollow capillary head;
- pressing down on the ball with the hollow capillary head such that the ball contacts the bond pad and deforms;
- and
- applying ultrasonic energy at the third portion of the hollow capillary head to form a ball bond with the bond pad on the semiconductor die.
Dependencies are inferred from the claim text.