Back to results
US 12,610,851 B2Granted
Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYongMoo Shin, SeongKuk Kim, SinJae Kim, SeokBeom Heo
Life of this patent
Estimating the term…
Abstract
A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.
Claims23
A semiconductor device, comprising:
- a substrate;
- an electrical component mounted to a first surface of the substrate;
- a conductive pillar disposed over the first surface of the substrate within a height of the electrical component;
- a conductive layer formed on a top surface and a side surface of the conductive pillar;
- a solder, solder paste, or conductive paste disposed between and physically contacting the conductive pillar and substrate;
- an encapsulant deposited over the substrate, electrical component, and conductive pillar, wherein the conductive pillar is embedded in the encapsulant with an end of the conductive pillar exposed from the encapsulant;
- and
- a solder bump formed over the conductive pillar outside the encapsulant.
5 more elements
A semiconductor device, comprising:
- a substrate;
- a conductive pillar disposed over a first surface of the substrate;
- a solder, solder paste, or conductive paste disposed between and physically contacting the conductive pillar and substrate;
- an encapsulant deposited around the conductive pillar, wherein the conductive pillar extends through the encapsulant;
- and
- a solder bump formed over the conductive pillar outside the encapsulant.
3 more elements
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing an electrical component over a first surface of the substrate;
- disposing a solder paste over the first surface of the substrate;
- disposing a conductive pillar on the solder paste;
- depositing an encapsulant over the first surface of the substrate, the electrical component, and the conductive pillar, wherein the encapsulant extends around the conductive pillar;
- and
- forming a solder bump over the conductive pillar.
4 more elements
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a conductive paste over a first surface of the substrate;
- forming a conductive pillar;
- disposing the conductive pillar over the conductive paste after forming the conductive pillar, wherein the conductive pillar is disposed as an isolated conductive pillar devoid of insulating material attached to the conductive pillar;
- and
- forming a solder bump over the conductive pillar.
3 more elements
Dependencies are inferred from the claim text.