H10W 72/927
Multiple bond pads having different structures
Official title: {Multiple bond pads having different structures}
H10W72/927 (Multiple bond pads having different structures) appears on 31 US grants and 35 published applications in this corpus.
Search patents in H10W- Granted patents
- 31
- Published applications
- 35
- Assignees
- 27
- Inventors
- 65
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 1 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 6 |
| 2015 | 5 | 10 |
| 2016 | 5 | 4 |
| 2017 | 4 | 3 |
| 2018 | 3 | 0 |
| 2019 | 2 | 1 |
| 2020 | 2 | 0 |
| 2021 | 0 | 2 |
| 2022 | 0 | 2 |
| 2023 | 3 | 2 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 3 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Circuit board, image forming apparatus, mounting method onto circuit board, and method of manufacturing plurality of image forming apparatus15 Sep 2026US 12,740,416 B2Canon Kabushiki Kaisha
- Display device1 Sep 2026US 12,724,310 B2Samsung Display Co., Ltd.
- Semiconductor package and method of manufacturing the semiconductor package4 Aug 2026US 12,702,034 B2Samsung Electronics Co., Ltd.
- Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance10 Jun 2025US 12,327,806 B2Airoha Technology (HK) Limited
- Solid-state imaging device and electronic apparatus30 Jan 2024US 11,887,950 B2Sony Semiconductor Solutions Corporation
- Semiconductor package and method of manufacturing the semiconductor package17 Oct 2024US 2024/0347487 A1Samsung Electronics Co., Ltd.
- Circuit board, image forming apparatus, mounting method onto circuit board, and method of manufacturing plurality of image forming apparatus28 Mar 2024US 2024/0105643 A1Canon Kabushiki Kaisha
- Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire t-coil circuit with equivalent negative inductance14 Dec 2023US 2023/0402416 A1Airoha Technology (HK) Limited
- Method of forming a metal-insulator-metal (mim) capacitor16 Mar 2023US 2023/0079474 A1Microchip Technology Incorporated
- Display device13 Oct 2022US 2022/0328439 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Hybrid bonding with air-gap structure246US 9,312,229 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with air-gap structure242US 9,960,142 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Air trench in packages incorporating hybrid bonding239US 9,443,796 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate18US 8,841,779 B2STATS ChipPAC, Ltd. · 2014
- Method for self-aligned solder reflow bonding and devices obtained thereof12US 9,978,710 B2Imec Vzw · 2018