Circuit board, image forming apparatus, mounting method onto circuit board, and method of manufacturing plurality of image forming apparatus
AssigneeCanon Kabushiki Kaisha
InventorTAKERU IMAMURA
Life of this patent
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Abstract
A circuit board on which a first semiconductor device or a second semiconductor device which is different from the first semiconductor device is exclusively mounted, wherein the circuit board comprises a region in which a component configured to form a circuit for achieving a function incorporated in the first semiconductor device but not incorporated in the second semiconductor device is to be mounted, and wherein the component is prevented from being mounted in the region in a case where the first semiconductor device is mounted, and the component is mounted in the region in a case where the second semiconductor device is mounted.
Claims12
A circuit board on which a first semiconductor device or a second semiconductor device which is different from the first semiconductor device is exclusively mounted,
- wherein the circuit board comprises a region in which a component configured to form a circuit for achieving a function incorporated in the first semiconductor device but not incorporated in the second semiconductor device is to be mounted, and
- wherein the component is prevented from being mounted in the region in a case where the first semiconductor device is mounted, and the component is mounted in the region in a case where the second semiconductor device is mounted.
An image forming apparatus comprising:
- a constituent component for use in forming an image;
- and
- a circuit board which is connected to the constituent component, and on which a first semiconductor device or a second semiconductor device which is different from the first semiconductor device is exclusively mounted,
- wherein the circuit board includes a region in which a component configured to form a circuit for achieving a function incorporated in the first semiconductor device but not incorporated in the second semiconductor device is to be mounted, and
- wherein the component is prevented from being mounted in the region in a case where the first semiconductor device is mounted, and the component is mounted in the region in a case where the second semiconductor device is mounted.
A mounting method onto a circuit board on which a first semiconductor device or a second semiconductor device which is different from the first semiconductor device is exclusively mountable,
- the circuit board having a region in which a component for use in achieving a function incorporated in the first semiconductor device but not incorporated in the second semiconductor device is to be mounted,
- the mounting method comprising preventing the component from being mounted in the region in a case where the first semiconductor device is mounted, and mounting the component in the region in a case where the second semiconductor device is mounted.
A method of manufacturing a plurality of image forming apparatus, the method comprising:
- preparing a first image forming apparatus including a first circuit board;
- preparing a second image forming apparatus including a second circuit board;
- arranging, on the first circuit board, a first semiconductor device configured to execute a first function and a second function;
- and
- arranging, on the second circuit board, a second semiconductor device configured to execute the first function and a component configured to form a circuit configured to execute the second function,
- wherein the first circuit board further includes a region in which the second semiconductor device of the second image forming apparatus is arrangeable, and a region in which the component of the second image forming apparatus is arrangeable, and
- wherein the second circuit board further includes a region in which the first semiconductor device of the first image forming apparatus is arrangeable.
Dependencies are inferred from the claim text.