Solid-state imaging device and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorTakuya Nakamura
Life of this patent
Estimating the term…
Abstract
A solid-state imaging device to be provided includes a first semiconductor device including a semiconductor layer in which a photoelectric conversion unit that photoelectrically converts incident light and a penetrating via are provided, a first connecting portion and a second connecting portion on the surface side of the semiconductor layer on the side that receives the light, and a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via. The solid-state imaging device further includes a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion. The solid-state imaging device is connected to an external terminal by the second connecting portion.
Claims12
A solid-state imaging device, comprising:
- a first semiconductor device including:
- a semiconductor layer that includes:
- a photoelectric conversion unit configured to photoelectrically convert incident light;
- and
- a penetrating via;
- a first connecting portion on a surface side of the semiconductor layer, wherein the surface side of the semiconductor layer is configured to receive the incident light;
- a second connecting portion on the surface side of the semiconductor layer;
- and
- a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via, wherein
- the connecting wiring line includes a first wiring line and a second wiring line, and
- the first connecting portion is in a recessed structure included in the second wiring line;
- and
- a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion,
- wherein the solid-state imaging device is connected to an external terminal by the second connecting portion.
An electronic apparatus, comprising:
- a solid-state imaging device including:
- a first semiconductor device including:
- a semiconductor layer that includes:
- a photoelectric conversion unit configured to photoelectrically convert incident light;
- and
- a penetrating via;
- a first connecting portion on a surface side of the semiconductor layer, wherein the surface side of the semiconductor layer is configured to receive the incident light;
- a second connecting portion on the surface side of the semiconductor layer;
- a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via, wherein
- the connecting wiring line includes a first wiring line and a second wiring line, and
- the first connecting portion is in a recessed structure included in the second wiring line;
- and
- a color filter above the semiconductor layer;
- and
- a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion,
- wherein the solid-state imaging device is connected to an external terminal by the second connecting portion.
A solid-state imaging device, comprising:
- a first semiconductor device including:
- a semiconductor layer that includes:
- a photoelectric conversion unit configured to photoelectrically convert incident light;
- and
- a penetrating via;
- a first connecting portion on a surface side of the semiconductor layer, wherein
- the surface side of the semiconductor layer is configured to receive the incident light,
- the first connecting portion has a two-layer structure, and
- the two-layer structure includes a copper-containing layer and a cobalt-containing layer in order from the surface side of the semiconductor layer;
- a second connecting portion on the surface side of the semiconductor layer;
- and
- a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via;
- and
- a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion,
- wherein the solid-state imaging device is connected to an external terminal by the second connecting portion.
Dependencies are inferred from the claim text.