Hybrid bonding with air-gap structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Ying Chen, Dun-Nian Yaung
Life of this patent
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Abstract
A package component includes a surface dielectric layer having a first planar surface, and a metal pad in the surface dielectric layer. The metal pad includes a diffusion barrier layer that includes sidewall portions, and a metallic material encircled by the sidewall portions of the diffusion barrier layer. The metallic material has a second planar surface level with the first planar surface. An air gap extends from the second planar surface of the metallic material into the metallic material. An edge of the air gap is aligned to an edge of the metallic material.
Claims20
A package comprising:
- a first package component comprising:
- a first surface dielectric layer comprising a first planar surface;
- and
- a first metal pad in the first surface dielectric layer, wherein the first metal pad comprises:
- a first diffusion barrier layer comprising sidewall portions;
- a first metallic material encircled by the sidewall portions of the first diffusion barrier layer, wherein the first metallic material comprises a second planar surface level with the first planar surface;
- and
- an air gap extending from the second planar surface of the first metallic material into the first metallic material;
- and
- a second package component overlapping the first package component, wherein the second package component comprises:
- a second surface dielectric layer comprising a third planar surface bonded to the first planar surface;
- and
- a second metal pad in the second surface dielectric layer, wherein the second metal pad has a fourth planar surface bonded to the second planar surface, and the air gap is overlapped by the second metal pad.
A package comprising:
- a first package component comprising:
- a first surface dielectric layer;
- and
- a first metal pad in the first surface dielectric layer, wherein the first metal pad comprises a first surface and a second surface opposite to the first surface;
- a first air gap extending from the first surface of the first metal pad into the first metal pad, wherein the first air gap stops at an intermediate level between the first surface and the second surface;
- and
- a second package component comprising:
- a second surface dielectric layer bonded to a first surface of the first surface dielectric layer;
- and
- a second metal pad in the second surface dielectric layer, wherein the second metal pad is bonded to the first metal pad;
- and
- a second air gap extending from a surface of the second metal pad into the second metal pad, wherein the second air gap is joined to the first air gap.
A method comprising:
- forming a first package component comprising:
- forming a first surface dielectric layer at a surface of an initial structure of the first package component;
- etching the first surface dielectric layer to form an opening;
- filling the opening with conductive materials;
- and
- performing a Chemical Mechanical Polish (CMP) to remove excess portions of the conductive materials, wherein remaining portions of the conductive materials form a first metal pad, with a first trench ring generated in the first metal pad and adjacent to peripherals of the first metal pad;
- and
- bonding the first package component to a second package component, wherein the first metal pad is bonded to a second metal pad of the second package component, and wherein the first surface dielectric layer is bonded to a second surface dielectric layer of the second package component.
Dependencies are inferred from the claim text.