Back to results
US 12,327,806 B2Granted
Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance
AssigneeAiroha Technology (HK) Limited
InventorsHuan-Sheng Chen, Ming-Yin Ko, Chun-Wei Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.
Claims17
A semiconductor die comprising:
- a processing circuit;
- a first bond pad, electrically connected to a first node of the processing circuit and a first bond wire;
- and
- a second bond pad, electrically connected to a second node of the processing circuit and a second bond wire;
- wherein the first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.
2 more elements
A semiconductor die comprising:
- a differential circuit;
- a first bond pad, electrically connected to a first node of the differential circuit, wherein a first signal at the first node is a positive signal of a first differential signal;
- a second bond pad, electrically connected to a second node of the differential circuit, wherein a second signal at the second node is a negative signal of a second differential signal;
- a third bond pad, electrically connected to a third node of the differential circuit, wherein a third signal at the third node is a negative signal of the first differential signal;
- and
- a fourth bond pad, electrically connected to a fourth node of the differential circuit, wherein a fourth signal at the fourth node is a positive signal of the second differential signal;
- wherein the first bond pad is adjacent to the second bond pad, and the third bond pad is adjacent to the fourth bond pad.
4 more elements
Dependencies are inferred from the claim text.