Back to results
US 9,443,796 B2Granted
Air trench in packages incorporating hybrid bonding
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang, Xin-Chung Kuang, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
Life of this patent
Estimating the term…
Abstract
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
Claims20
A package comprising:
- a first package component comprising:
- a first surface dielectric layer comprising a first planar top surface;
- a first metal pad in the first surface dielectric layer and comprising a second planar top surface level with the first planar top surface;
- and
- a first air trench on a side of the first metal pad, wherein a sidewall of the first metal pad and a sidewall of the first surface dielectric layer are both exposed to the first air trench.
2 more elements
A package comprising:
- a die comprising:
- a first surface dielectric layer;
- and
- a first metal pad in the first surface dielectric layer;
- and
- a package component comprising:
- a second surface dielectric layer bonded to the first surface dielectric layer;
- a second metal pad in the second surface dielectric layer and bonded to the first metal pad;
- and
- an air trench extending from within the first surface dielectric layer into the second surface dielectric layer.
7 more elements
A package comprising:
- a first package component comprising:
- a first surface dielectric layer;
- and
- a first metal pad in the first surface dielectric layer;
- and
- a second package component bonded to the first package component through hybrid bonding, wherein the second package component comprises:
- a second surface dielectric layer bonded to the first surface dielectric layer through fusion bonding;
- a second metal pad in the second surface dielectric layer and bonded to the first metal pad;
- and
- a first air trench, wherein a first sidewall of the first metal pad and a second sidewall of the first surface dielectric layer are exposed to the first air trench, and wherein the second surface dielectric layer is exposed to the first air trench.
7 more elements
Dependencies are inferred from the claim text.