H10W 72/926
Multiple bond pads having different sizes
Official title: {Multiple bond pads having different sizes}
H10W72/926 (Multiple bond pads having different sizes) appears on 4,855 US grants and 5,631 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,855
- Published applications
- 5,631
- Assignees
- 701
- Inventors
- 6,919
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 9 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 10 | 0 |
| 1996 | 15 | 0 |
| 1997 | 17 | 0 |
| 1998 | 21 | 0 |
| 1999 | 28 | 0 |
| 2000 | 38 | 0 |
| 2001 | 43 | 33 |
| 2002 | 53 | 59 |
| 2003 | 52 | 67 |
| 2004 | 52 | 75 |
| 2005 | 64 | 123 |
| 2006 | 74 | 127 |
| 2007 | 74 | 140 |
| 2008 | 77 | 133 |
| 2009 | 86 | 179 |
| 2010 | 131 | 158 |
| 2011 | 135 | 174 |
| 2012 | 179 | 242 |
| 2013 | 213 | 221 |
| 2014 | 208 | 245 |
| 2015 | 252 | 296 |
| 2016 | 259 | 268 |
| 2017 | 265 | 261 |
| 2018 | 264 | 293 |
| 2019 | 278 | 323 |
| 2020 | 284 | 338 |
| 2021 | 278 | 404 |
| 2022 | 294 | 469 |
| 2023 | 304 | 355 |
| 2024 | 320 | 308 |
| 2025 | 288 | 223 |
| 2026 | 147 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
- Semiconductor package and method of manufacturing the semiconductor package1 Oct 2026US 2026/0305403 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Gallium nitride-based III-V group compound semiconductor device and method of producing the same291US 5,563,422 ANichia Chemical Industries, Ltd. · 1996
- Semiconductor device and method of manufacturing semiconductor device273US 7,402,901 B2Sony Corporation · 2008
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999