H10W 72/931
Shapes of bond pads
Official title: {Shapes of bond pads}
H10W72/931 (Shapes of bond pads) appears on 13,081 US grants and 13,305 published applications in this corpus.
Search patents in H10W- Granted patents
- 13,081
- Published applications
- 13,305
- Assignees
- 1,696
- Inventors
- 18,171
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 15 | 0 |
| 1985 | 19 | 0 |
| 1986 | 20 | 0 |
| 1987 | 12 | 0 |
| 1988 | 8 | 0 |
| 1989 | 35 | 0 |
| 1990 | 55 | 0 |
| 1991 | 65 | 0 |
| 1992 | 74 | 0 |
| 1993 | 76 | 0 |
| 1994 | 105 | 0 |
| 1995 | 103 | 0 |
| 1996 | 112 | 0 |
| 1997 | 121 | 0 |
| 1998 | 200 | 0 |
| 1999 | 217 | 0 |
| 2000 | 297 | 0 |
| 2001 | 285 | 159 |
| 2002 | 352 | 454 |
| 2003 | 366 | 452 |
| 2004 | 392 | 443 |
| 2005 | 389 | 561 |
| 2006 | 351 | 504 |
| 2007 | 370 | 580 |
| 2008 | 332 | 616 |
| 2009 | 351 | 565 |
| 2010 | 492 | 590 |
| 2011 | 542 | 600 |
| 2012 | 541 | 590 |
| 2013 | 593 | 562 |
| 2014 | 616 | 634 |
| 2015 | 599 | 662 |
| 2016 | 632 | 607 |
| 2017 | 606 | 513 |
| 2018 | 492 | 505 |
| 2019 | 457 | 459 |
| 2020 | 423 | 538 |
| 2021 | 440 | 624 |
| 2022 | 442 | 606 |
| 2023 | 448 | 429 |
| 2024 | 449 | 474 |
| 2025 | 351 | 365 |
| 2026 | 197 | 213 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,790 B2Samsung Electronics Co., Ltd.
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Direct hybrid bond pad having tapered sidewall29 Sep 2026US 12,751,328 B2Adeia Semiconductor Bonding Technologies Inc.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods for fabricating the same8 Oct 2026US 2026/0314446 A1Samsung Electronics Co., Ltd.
- Low resistance structures in systems8 Oct 2026US 2026/0314467 A1Micron Technology, Inc.
- Semiconductor device and method of fabricating semiconductor package8 Oct 2026US 2026/0314476 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001