Semiconductor packages and methods for fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJaemok Jung, Un-Byoung Kang, Dowan Kim, Sung Keun Park, Jongho Park, Ju-Il Choi
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Abstract
A method of fabricating a semiconductor package, the method includes forming a bonding pad on a first redistribution layer substrate, bonding a first end of a bonding wire on the bonding pad, electroplating on the bonding wire to form a metal portion around the bonding wire, mounting a semiconductor chip on the first redistribution layer substrate, molding the metal portion and the semiconductor chip with an encapsulant, and forming a second redistribution layer substrate on the encapsulant, a second end of the bonding wire being bonded to the second redistribution layer substrate.
Claims20
A method of fabricating a semiconductor package, the method comprising:
- forming a bonding pad on a first redistribution layer substrate;
- bonding a first end of a bonding wire on the bonding pad;
- electroplating on the bonding wire to form a metal portion around the bonding wire;
- mounting a semiconductor chip on the first redistribution layer substrate;
- molding the metal portion and the semiconductor chip with an encapsulant;
- and
- forming a second redistribution layer substrate on the encapsulant, wherein a second end of the bonding wire is bonded to the second redistribution layer substrate.
A method of fabricating a semiconductor package, comprising:
- forming a first redistribution layer substrate;
- forming bonding pads on the first redistribution layer substrate;
- forming bonding wires on the bonding pads;
- forming metal portions around the bonding wires;
- mounting a semiconductor chip on the first redistribution layer substrate;
- molding the metal portions and the semiconductor chip with an encapsulant;
- and
- forming a second redistribution layer substrate on the encapsulant.
A method of fabricating a semiconductor package, comprising:
- forming a first redistribution layer substrate;
- forming first bonding pads and second bonding pads on the first redistribution layer substrate;
- forming bonding wires on the first bonding pads;
- forming metal portions on the first bonding pads and around the bonding wires;
- mounting a semiconductor chip on the second bonding pads;
- molding the metal portions and the semiconductor chip with an encapsulant;
- and
- forming a second redistribution layer substrate on the encapsulant.
Dependencies are inferred from the claim text.