H10W 72/934
Cross-sectional shape, i.e. in side view
Official title: {Cross-sectional shape, i.e. in side view}
H10W72/934 (Cross-sectional shape, i.e. in side view) appears on 3,412 US grants and 3,803 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,412
- Published applications
- 3,803
- Assignees
- 584
- Inventors
- 5,707
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 10 | 0 |
| 1994 | 19 | 0 |
| 1995 | 15 | 0 |
| 1996 | 22 | 0 |
| 1997 | 22 | 0 |
| 1998 | 37 | 0 |
| 1999 | 43 | 0 |
| 2000 | 59 | 0 |
| 2001 | 77 | 37 |
| 2002 | 70 | 98 |
| 2003 | 79 | 101 |
| 2004 | 83 | 92 |
| 2005 | 75 | 129 |
| 2006 | 76 | 94 |
| 2007 | 76 | 121 |
| 2008 | 72 | 126 |
| 2009 | 77 | 100 |
| 2010 | 93 | 138 |
| 2011 | 118 | 148 |
| 2012 | 130 | 143 |
| 2013 | 124 | 123 |
| 2014 | 152 | 152 |
| 2015 | 150 | 166 |
| 2016 | 138 | 141 |
| 2017 | 142 | 128 |
| 2018 | 131 | 153 |
| 2019 | 134 | 157 |
| 2020 | 144 | 201 |
| 2021 | 159 | 264 |
| 2022 | 195 | 268 |
| 2023 | 173 | 211 |
| 2024 | 215 | 210 |
| 2025 | 171 | 188 |
| 2026 | 88 | 114 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Direct hybrid bond pad having tapered sidewall29 Sep 2026US 12,751,328 B2Adeia Semiconductor Bonding Technologies Inc.
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- Semiconductor device15 Sep 2026US 12,740,074 B2Kioxia Corporation
- Semiconductor device and method of fabricating semiconductor package8 Oct 2026US 2026/0314476 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Backlight Unit and Display Device Including the Same1 Oct 2026US 2026/0305467 A1LG Display Co., Ltd.
- Semiconductor package1 Oct 2026US 2026/0305485 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Multi-dice chip scale semiconductor components and wafer level methods of fabrication456US 6,841,883 B1Micron Technology, Inc. · 2005
- TSV structures and methods for forming the same396US 8,803,316 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Chip stack package and manufacturing method thereof368US 7,276,799 B2Samsung Electronics Co., Ltd. · 2007
- Semiconductor thin film formed on a supporting substrate355US 5,646,432 ASeiko Instruments Inc. · 1997