TSV structures and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin
Life of this patent
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Abstract
A device includes a substrate having a front side and a backside, a through-via extending from the backside to the front side of the substrate, and a conductive pad on the backside of the substrate and over the through-via. The conductive pad has a substantially planar top surface. A conductive bump has a non-planar top surface over the substantially planar top surface and aligned to the through-via. The conductive bump and the conductive pad are formed of a same material. No interface is formed between the conductive bump and the conductive pad.
Claims20
A device comprising:
- a substrate comprising a front side and a backside;
- a through-via extending from the backside to the front side of the substrate;
- a conductive pad on the backside of the substrate and over the through-via, wherein the conductive pad comprises a substantially planar top surface;
- and
- a conductive bump having a non-planar top surface over the substantially planar top surface and aligned to the through-via, wherein the conductive bump and the conductive pad are formed of a same material, and wherein no interface is formed between the conductive bump and the conductive pad.
A device comprising:
- a semiconductor substrate comprising a front side and a backside;
- a through-via extending from the backside to the front side of the semiconductor substrate;
- a metal connector on the backside of the semiconductor substrate and over the through-via, wherein the metal connector comprises:
- a substantially planar top surface;
- and
- a non-planar top surface smoothly connected to the substantially planar top surface;
- and
- a metal feature over and in contact with the substantially planar top surface and the non-planar top surface of the metal connector, wherein the metal feature and the metal connector comprise different materials.
A device comprising:
- a substrate comprising a front side and a backside;
- a through-substrate via (TSV) extending from the front side to the backside of the substrate;
- a first metal feature on the backside of the substrate and over the TSV relative the backside of the substrate, wherein the first metal feature has a first portion having a substantially planar top surface and a second portion over the first portion relative the backside of the substrate, the second portion having a non-planar top surface;
- and
- a second metal feature over and contacting the first metal feature relative the backside, wherein the first and second metal features are formed of different materials.
Dependencies are inferred from the claim text.