H10W 72/936
Multiple bond pads having different shapes
Official title: {Multiple bond pads having different shapes}
H10W72/936 (Multiple bond pads having different shapes) appears on 623 US grants and 821 published applications in this corpus.
Search patents in H10W- Granted patents
- 623
- Published applications
- 821
- Assignees
- 238
- Inventors
- 1,517
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 1 |
| 2002 | 7 | 8 |
| 2003 | 5 | 6 |
| 2004 | 3 | 9 |
| 2005 | 9 | 12 |
| 2006 | 9 | 12 |
| 2007 | 5 | 12 |
| 2008 | 6 | 17 |
| 2009 | 6 | 8 |
| 2010 | 7 | 18 |
| 2011 | 10 | 15 |
| 2012 | 19 | 25 |
| 2013 | 25 | 18 |
| 2014 | 21 | 28 |
| 2015 | 29 | 47 |
| 2016 | 36 | 31 |
| 2017 | 33 | 29 |
| 2018 | 33 | 47 |
| 2019 | 33 | 43 |
| 2020 | 42 | 49 |
| 2021 | 51 | 81 |
| 2022 | 46 | 75 |
| 2023 | 47 | 52 |
| 2024 | 58 | 71 |
| 2025 | 40 | 66 |
| 2026 | 29 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package22 Sep 2026US 12,745,678 B2Samsung Electronics Co., Ltd.
- Semiconductor device comprising bonded a plurality of semiconductor structures along with conductive layers and bonding pads15 Sep 2026US 12,740,396 B2SK hynix Inc.
- Semiconductor package and method of manufacturing the semiconductor package15 Sep 2026US 12,740,485 B2Samsung Electronics Co., Ltd.
- Semiconductor package with dummy pads8 Sep 2026US 12,733,475 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same8 Sep 2026US 12,733,546 B2Samsung Electronics Co., Ltd.
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Package with t-shaped source electrode1 Oct 2026US 2026/0305387 A1GaNrich Semiconductor Corporation
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Micro package structure1 Oct 2026US 2026/0305480 A1Hue Inc.
- Micro package structure1 Oct 2026US 2026/0305481 A1Hue Inc.
Most cited
By later US patents
- Vertical power mosfet having thick metal layer to reduce distributed resistance258US 5,665,996 ASiliconix Incorporated · 1997
- Personalization structure for semiconductor devices209US 5,883,435 AInternational Business Machines Corporation · 1999
- III-nitride light-emitting device with increased light generating capability185US 6,486,499 B1Lumileds Lighting U.S., LLC · 2002
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- LED power package154US 6,964,877 B2GELcore, LLC · 2005