LED power package

A method for producing a plurality of surface mount light emitting diode (LED) packages, the method including:

• fabricating a plurality of light emitting diode (LED) dice each including light emitting semiconductor layers disposed on a light-transmissive substrate, and frontside p-type and n-type contacts disposed on the light emitting semiconductor layers opposite the light-transmissive substrate;
• drilling a plurality of arrays of openings into an electrically insulating sub-mount wafer;
• applying a metal to the drilled openings to produce a plurality of via arrays;
• flip-chip bonding the LED dice onto a frontside of the electrically insulating sub-mount wafer, the p-type and n-type contacts of each flip-chip bonded LED electrically communicating with a solderable backside of the electrically insulating sub-mount wafer through a via array;
• providing a thermal conduction path for thermally conducting heat from the flip-chip bonded LED dice to the solderable backside of the electrically insulating sub-mount wafer, and
• subsequent to the flip-chip bonding, separating the electrically insulating sub-mount wafer to produce surface mount LED packages each including at least one LED die.